Prof. Dr.-Ing. Ulrich Tetzlaff


Studiengangleiter und Studienfachberater Werkstofftechnik im Maschinenbau (Master)

Raum: A232
Lehrgebiet: Werkstofftechnik, Spanlose Fertigungstechnik und Verbundwerkstoffe

Forschung


  • Kriech- und Ermüdungsverhalten metallischer Verbundwerkstoffe
  • Tribologie metallischer Verbundwerkstoffe
  • Hochtemperaturverhalten bleifreier Lotwerkstoffe

Vita


  • Seit 2009: Professor an der THI, Laborbeauftragter der Fakultät Maschinenbau, Leiter des Labors Werkstoffanalytik
  • 2001-2008: AUDI AG: Metallurgie der Aggregate
  • 1990-2000: Studium der Werkstoffwissenschaften, Wissenschaftlicher Mitarbeiter am Institut für allgemeine Werkstoffeigenschaften, Promotion

Sonstige Aktivitäten

Mitglied des AWARE-Programms

Publikationen

2024
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2024.147354
MOHD, Zubair Akhtar, Christian KREINER, Maximilian SCHMID, Andreas ZIPPELIUS, Ulrich TETZLAFF und Gordon ELGER, 2024. Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to Improve SAC Solder Reliability Analysis. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings. Piscataway: IEEE. ISBN 979-8-3503-9036-0. Verfügbar unter: https://doi.org/10.1109/ESTC60143.2024.10712023
GOTTWALT, Albin, Paul KUBASCHINSKI, Manuela WALTZ und Ulrich TETZLAFF, 2024. Influence of Subsequent Heat Treatment on Fatigue Behavior of Shear-Cut Electrical Steel Sheets. Alloys, 3(4), 281-294. ISSN 2674-063X. Verfügbar unter: https://doi.org/10.3390/alloys3040017
VIEWEGER, Daniel, Sergej DIEL, Hans-Georg SCHWEIGER und Ulrich TETZLAFF, 2024. Mechanical Properties of Raw Filaments and Printed Specimens: Effects of Fiber Reinforcements and Process Parameters. Polymers, 16(11), 1576. ISSN 2073-4360. Verfügbar unter: https://doi.org/10.3390/polym16111576
VOLPATO, Guilherme, A. S. P. PEREIRA, Márcio Celso FREDEL und Ulrich TETZLAFF, 2024. On the Development of a Heat Treatment for Inconel Alloy X-750 Produced Using Laser Powder Bed Fusion. Metallurgical and Materials Transactions A: Physical metallurgy and materials science, 55(11), 4585-4599. ISSN 1073-5623. Verfügbar unter: https://doi.org/10.1007/s11661-024-07589-0
2023
KIEHL, Maximilian, Adriano SCHEID, Karin GRAF, Benedikt ERNST und Ulrich TETZLAFF, 2023. Coaxial laser cladding of cobalt-base alloy Stellite™ 6 on gray cast iron/investigations on friction, wear versus commercial brake pad, and corrosion characteristics. Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering, 237(14), 3285-3303. ISSN 2041-2991. Verfügbar unter: https://doi.org/10.1177/09544070221145512
GOTTWALT, Albin, Paul KUBASCHINSKI, Manuela WALTZ, Rainer VÖLKL, Uwe GLATZEL und Ulrich TETZLAFF, 2023. Cyclic deformation behavior of non-oriented electrical steel sheets. Materials Science and Engineering: A, 2023(886), 145684. ISSN 0921-5093. Verfügbar unter: https://doi.org/10.1016/j.msea.2023.145684
GOTTWALT, Albin, Paul KUBASCHINSKI, Manuela WALTZ und Ulrich TETZLAFF, 2023. Influence of the cutting method on the fatigue life and crack initiation of non-oriented electrical steel sheets. International Journal of Fatigue, 2024(180), 108073. ISSN 1879-3452. Verfügbar unter: https://doi.org/10.1016/j.ijfatigue.2023.108073
KUBASCHINSKI, Paul, Albin GOTTWALT, Ulrich TETZLAFF, Holm ALTENBACH und Manuela WALTZ, 2023. Modelling and simulation of the hardness profile and its effect on the stress‐strain behaviour of punched electrical steel sheets. Materials Science & Engineering Technology, 54(4), 512-526. ISSN 0933-5137. Verfügbar unter: https://doi.org/10.1002/mawe.202200283
VOLPATO, Guilherme, A. S. P. PEREIRA, Georges LEMOS, Matthias SCHMITT, Uwe GLATZEL, Florian PYCZAK, Ulrich TETZLAFF und Márcio Celso FREDEL, 2023. Out-of-Equilibrium Formation of Ni3Ti η-Phase in Inconel X-750 Produced via Laser Powder Bed Fusion and Spark Plasma Sintering. Metallurgical and Materials Transactions A: Physical metallurgy and materials science, 54(5), 1924-1936. ISSN 1073-5623. Verfügbar unter: https://doi.org/10.1007/s11661-022-06946-1
DE SOUZA PINTO PEREIRA, Adriano, Jhonattan GUTJAHR, Milton PEREIRA, Ulrich TETZLAFF und Márcio Celso FREDEL, 2023. Processability of thin-powdered Inconel X750 and TiC metal matrix composite by laser-directed energy deposition. Journal of Laser Applications, 35(4), 042040. ISSN 1042-346X. Verfügbar unter: https://doi.org/10.2351/7.0001134
2022
VOLPATO, Guilherme, Ulrich TETZLAFF und Márcio Celso FREDEL, 2022. A comprehensive literature review on laser powder bed fusion of Inconel superalloys. Additive Manufacturing, 2022(55), 102871. ISSN 2214-7810. Verfügbar unter: https://doi.org/10.1016/j.addma.2022.102871
GOTTWALT, Albin, Paul KUBASCHINSKI, Manuela WALTZ, Uwe GLATZEL und Ulrich TETZLAFF, 2022. An experimental setup for fatigue testing of thin electrical steel sheets. International Journal of Fatigue, 2022(162), 106987. ISSN 0142-1123. Verfügbar unter: https://doi.org/10.1016/j.ijfatigue.2022.106987
KUBASCHINSKI, Paul, Albin GOTTWALT, Ulrich TETZLAFF, Holm ALTENBACH und Manuela WALTZ, 2022. Calibration of a combined isotropic-kinematic hardening material model for the simulation of thin electrical steel sheets subjected to cyclic loading. Materials Science & Engineering Technology, 53(4), 422-439. ISSN 1521-4052. Verfügbar unter: https://doi.org/10.1002/mawe.202100341
KIEHL, Maximilian, Adriano SCHEID, Karin GRAF, Benedikt ERNST und Ulrich TETZLAFF, 2022. Coaxial Laser Cladding of Cobalt-Base Alloy Stellite™ 6 on Grey Cast Iron Analysis of the Microstructural and Mechanical Properties Depending on the Laser Power. Journal of Materials Engineering and Performance, 32(8), 3821-3838. ISSN 1544-1024. Verfügbar unter: https://doi.org/10.1007/s11665-022-07358-3
LEMOS, Georges, Márcio Celso FREDEL, Florian PYCZAK und Ulrich TETZLAFF, 2022. Creep resistance improvement of a polycrystalline Ni-based superalloy via TiC particles reinforcement. Materials Science and Engineering: A, 2022(854), 143821. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2022.143821
BENEDET DUTRA, Gabriel, Ulrich TETZLAFF, Tiago VIEIRA DA CUNHA, Carlos Eduardo DOS SANTOS und Georges LEMOS, 2022. Microstructural Characterization of an ERNiCrMo-3 and Grey Cast Iron Interface Obtained via TIG Welding. Metallurgical and Materials Transactions B, 53(4), 2534-2546. ISSN 1073-5615. Verfügbar unter: https://doi.org/10.1007/s11663-022-02549-8
ERNST, Benedikt, Simon KEIM und Ulrich TETZLAFF, 2022. On the anisotropic indentation modulus and anisotropic creep behavior of β-Sn characterized by nanoindentation methods. Materials Science and Engineering: A, 2022(848), 143392. ISSN 1873-4936. Verfügbar unter: https://doi.org/10.1016/j.msea.2022.143392
HANDWERKER, Michael, Jörg KESSLER, Hormoz MARZBANI und Ulrich TETZLAFF, 2022. Pressure and heat treatment of continuous fibre reinforced thermoplastics produced by fused filament fabrication. Progress in Additive Manufacturing, 8(2), 99-116. ISSN 2363-9520. Verfügbar unter: https://doi.org/10.1007/s40964-022-00315-5
KUBASCHINSKI, Paul, Albin BARUTH, Ulrich TETZLAFF, Holm ALTENBACH und Manuela WALTZ, 2022. Untersuchungen zur Ermittlung der zyklischen Kennwerte von dünnem Elektroblech im Rahmen der rechnerischen Lebensdauerabschätzung. In: Betriebsfestigkeit - Wissensmanagement und Methodenentwicklung entlang der Wertschöpfungskette, S.163-178. Verfügbar unter: https://doi.org/10.48447/BF-2022-014
2021
HANDWERKER, Michael, Jörg KESSLER, Hormoz MARZBANI und Ulrich TETZLAFF, 2021. Annealing of chopped and continuous fibre reinforced polyamide 6 produced by fused filament fabrication. Composites Part B: Engineering, 2021(223), 109119. ISSN 1879-1069. Verfügbar unter: https://doi.org/10.1016/j.compositesb.2021.109119
SCHMITT, Matthias, Albin GOTTWALT, Jakob WINKLER, Thomas TOBIE, Georg SCHLICK, Karsten STAHL, Ulrich TETZLAFF, Johannes SCHLIP und Gunther REINHART, 2021. Carbon Particle In-Situ Alloying of the Case-Hardening Steel 16MnCr5 in Laser Powder Bed Fusion. Metals, 11(6), 11060896. ISSN 2075-4701. Verfügbar unter: https://doi.org/10.3390/met11060896
2020
THAMBI, Joel Luther, Ulrich TETZLAFF, Andreas SCHIESSL, Klaus-Dieter LANG und Manuela WALTZ, 2020. Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach. Microelectronics Reliability, 2020(106), 113560. ISSN 0026-2714. Verfügbar unter: https://doi.org/10.1016/j.microrel.2019.113560
BHOGARAJU, Sri Krishna, Fosca CONTI, Hiren R. KOTADIA, Simon KEIM, Ulrich TETZLAFF und Gordon ELGER, 2020. Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging. Journal of Alloys and Compounds, 2020(844), 156043. ISSN 1873-4669. Verfügbar unter: https://doi.org/10.1016/j.jallcom.2020.156043
KEIM, Simon, Ulrich TETZLAFF und Gordon ELGER, 2020. The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content. In: Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Piscataway: IEEE, S.2005-2012. ISBN 978-1-7281-6180-8. Verfügbar unter: https://doi.org/10.1109/ECTC32862.2020.00312
2019
MOKHTARI, Omid, Fosca CONTI, Sri Krishna BHOGARAJU, Markus MEIER, Helmut SCHWEIGART, Ulrich TETZLAFF und Gordon ELGER, 2019. Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor. New Journal of Chemistry, 43(26), 10227-10231. ISSN 1369-9261. Verfügbar unter: https://doi.org/10.1039/C9NJ02135C
VOLPATO, Guilherme, Márcio Celso FREDEL und Ulrich TETZLAFF, 2019. Dry Sliding Wear and Fe Contamination of Investment-cast SiC Foam Reinforced Aluminum Matrix Composites. In: EuroBrake 2019 Conference Proceedings. Bishops Stortford: FISITA. ISBN 978-0-9572076-3-9.
LEMOS, Georges, Márcio Celso FREDEL, Florian PYCZAK und Ulrich TETZLAFF, 2019. Influence of distinct manufacturing processes on the microstructure of Ni-based metal matrix composites submitted to long thermal exposure. Key Engineering Materials, 2019(809), 79-86. ISSN 1662-9795. Verfügbar unter: https://doi.org/10.4028/www.scientific.net/KEM.809.79
TETZLAFF, Ulrich, Alexander GERBER, Rudolf AMELANG und Georges LEMOS, 2019. Investigation of the Creep Resistance of a Spray-Compacted Si-Particle Reinforced Al-Based MMC (Dispal® S270). Key Engineering Materials, 2019(809), 87-93. ISSN 1662-9795. Verfügbar unter: https://doi.org/10.4028/www.scientific.net/KEM.809.87
GULDEN, Florian, B. REINHOLD, Sebastian GRAMSTAT, Ulrich TETZLAFF und Heinz Werner HÖPPEL, 2019. Investigation of the run-in and corrosion behavior of a PEO-coated aluminum brake disc. In: PFEFFER, Peter E., Hrsg. 10th International Munich Chassis Symposium 2019: chassis.tech plus. Wiesbaden: Springer Vieweg, S.611-631. ISBN 978-3-658-26435-2. Verfügbar unter: https://doi.org/10.1007/978-3-658-26435-2_43
CORRÊA DA SILVA, Cauê, Guilherme VOLPATO, Márcio Celso FREDEL und Ulrich TETZLAFF, 2019. Low-pressure processing and microstructural evaluation of unidirectional carbon fiber-reinforced aluminum-nickel matrix composites. Journal of Materials Processing Technology, 2019(269), 10-15. ISSN 0924-0136. Verfügbar unter: https://doi.org/10.1016/j.jmatprotec.2019.01.032
2018
GRAF, Karin, Ulrich TETZLAFF, Gelson BISCAIA DE SOUZA und Adriano SCHEID, 2018. Effect of Dilution on the Microstructure and Properties of CoCrMoSi alloy Coatings Processed on High-Carbon Substrate. Materials Research: Revista Ibero-Americana de Materiais, 22(1), e20180502. ISSN 1980-5373. Verfügbar unter: https://doi.org/10.1590/1980-5373-MR-2018-0502
GULDEN, Florian, Anton STICH, Sebastian GRAMSTAT, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2018. Investigations of the third body using pin-on-disc and brake dynamometer on all-MMC brake rotors. In: EuroBrake 2018 Conference Proceedings. Bishops Stortford: FISITA, S.401-407. ISBN 978-1-5108-7963-8.
GULDEN, Florian, Sebastian GRAMSTAT, Anton STICH, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2018. Properties and Limitation of an Oxide Coated Aluminum Brake Rotor. SAE technical papers, 2018-01-1877. ISSN 0148-7191. Verfügbar unter: https://doi.org/10.4271/2018-01-1877
2017
THAMBI, Joel Luther, Andreas SCHIESSL, Manuela WALTZ, Klaus-Dieter LANG und Ulrich TETZLAFF, 2017. Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys. Journal of Electronic Packaging, 139(3), 031002. ISSN 1528-9044. Verfügbar unter: https://doi.org/10.1115/1.4035850
2016
THAMBI, Joel Luther, Ulrich TETZLAFF, Andreas SCHIESSL, Klaus-Dieter LANG und Manuela WALTZ, 2016. High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach. Microelectronics Reliability, 98-105. ISSN 0026-2714. Verfügbar unter: https://doi.org/10.1016/j.microrel.2016.10.004