Prof. Dr.-Ing. Ulrich Tetzlaff

Programme director and Academic advisor Material Science in Engineering (Master)
Room:
A232
Subject Area:
Materials Science, Chipless Manufacturing Technology and Advanced Composites
Research
- Creep and fatigue behaviour of metallic composites
- Tribology of metallic composites
- High-temperature behaviour of lead-free solder materials
Vita
- Since 2009: Professor at THI, Laboratory Officer of the Faculty of Mechanical Engineering, Head of the Materials Analysis Laboratory
- 2001-2008: AUDI AG: Metallurgy of Aggregates
- 1990-2000: Studies in Materials Science, Research Assistant at the Institute for General Material Properties, PhD
Publications
2024
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354