Prof. Dr.-Ing. Manuela Waltz

Deputy Women's Representative, Programme director and Academic advisor Automotive Engineering

Room: A232
Subject Area: Engineering Mechanics

Research

  • Operational strength of elastomer components
  • Vibration resistance of joints

.

Vita

  • Since 2008: Professor at THI
  • 2004-2008: AUDI AG: Engineer in the department "Structural Durability, Body and Complete Vehicle".
  • 1999-2004: Laboratory for Lightweight Construction: Doctorate with the topic "Dynamic Behaviour of Rubber-Sprung Wheels
  • 1999-2001: RWTH Aachen: Postgraduate studies in the field of "Automotive Engineering".
  • 1994-1998: Studies in Aerospace Engineering

Publications

2024
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024, 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
ERNST, Benedikt, Paul KUBASCHINSKI, Andreas SCHIESSL, Manuela WALTZ, Heinz Werner HÖPPEL und Ulrich TETZLAFF, 2024. Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations. Materials Science and Engineering: A, 2024(916), 147354. ISSN 1873-4936. Available at: https://doi.org/10.1016/j.msea.2024.147354
GOTTWALT, Albin, Paul KUBASCHINSKI, Manuela WALTZ und Ulrich TETZLAFF, 2024. Influence of Subsequent Heat Treatment on Fatigue Behavior of Shear-Cut Electrical Steel Sheets. Alloys, 3(4), 281-294. ISSN 2674-063X. Available at: https://doi.org/10.3390/alloys3040017
2023
GOTTWALT, Albin, Paul KUBASCHINSKI, Manuela WALTZ, Rainer VÖLKL, Uwe GLATZEL und Ulrich TETZLAFF, 2023. Cyclic deformation behavior of non-oriented electrical steel sheets. Materials Science and Engineering: A, 2023(886), 145684. ISSN 0921-5093. Available at: https://doi.org/10.1016/j.msea.2023.145684
GOTTWALT, Albin, Paul KUBASCHINSKI, Manuela WALTZ und Ulrich TETZLAFF, 2023. Influence of the cutting method on the fatigue life and crack initiation of non-oriented electrical steel sheets. International Journal of Fatigue, 2024(180), 108073. ISSN 1879-3452. Available at: https://doi.org/10.1016/j.ijfatigue.2023.108073
KUBASCHINSKI, Paul, Albin GOTTWALT, Ulrich TETZLAFF, Holm ALTENBACH und Manuela WALTZ, 2023. Modelling and simulation of the hardness profile and its effect on the stress‐strain behaviour of punched electrical steel sheets. Materials Science & Engineering Technology, 54(4), 512-526. ISSN 0933-5137. Available at: https://doi.org/10.1002/mawe.202200283
2022
GOTTWALT, Albin, Paul KUBASCHINSKI, Manuela WALTZ, Uwe GLATZEL und Ulrich TETZLAFF, 2022. An experimental setup for fatigue testing of thin electrical steel sheets. International Journal of Fatigue, 2022(162), 106987. ISSN 0142-1123. Available at: https://doi.org/10.1016/j.ijfatigue.2022.106987
KUBASCHINSKI, Paul, Albin GOTTWALT, Ulrich TETZLAFF, Holm ALTENBACH und Manuela WALTZ, 2022. Calibration of a combined isotropic-kinematic hardening material model for the simulation of thin electrical steel sheets subjected to cyclic loading. Materials Science & Engineering Technology, 53(4), 422-439. ISSN 1521-4052. Available at: https://doi.org/10.1002/mawe.202100341
KUBASCHINSKI, Paul, Albin BARUTH, Ulrich TETZLAFF, Holm ALTENBACH und Manuela WALTZ, 2022. Untersuchungen zur Ermittlung der zyklischen Kennwerte von dünnem Elektroblech im Rahmen der rechnerischen Lebensdauerabschätzung. In: Betriebsfestigkeit - Wissensmanagement und Methodenentwicklung entlang der Wertschöpfungskette, Page163-178. Available at: https://doi.org/10.48447/BF-2022-014
2020
THAMBI, Joel Luther, Ulrich TETZLAFF, Andreas SCHIESSL, Klaus-Dieter LANG und Manuela WALTZ, 2020. Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach. Microelectronics Reliability, 2020(106), 113560. ISSN 0026-2714. Available at: https://doi.org/10.1016/j.microrel.2019.113560
2017
THAMBI, Joel Luther, Andreas SCHIESSL, Manuela WALTZ, Klaus-Dieter LANG und Ulrich TETZLAFF, 2017. Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys. Journal of Electronic Packaging, 139(3), 031002. ISSN 1528-9044. Available at: https://doi.org/10.1115/1.4035850
2016
THAMBI, Joel Luther, Ulrich TETZLAFF, Andreas SCHIESSL, Klaus-Dieter LANG und Manuela WALTZ, 2016. High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach. Microelectronics Reliability, 98-105. ISSN 0026-2714. Available at: https://doi.org/10.1016/j.microrel.2016.10.004